2016 International Conference on Electronics Packaging, April 20-22, 2016, Sapporo Education and Culture Hall.
Program: WB1 DMR-Mechanical
Topic: Non-destructive Testing Method for Chip Warpage - Applications of Synchrotron Radiation X-ray
詳細資訊請參閱ICEP 2016研討會網站:
ICEP 2016 http://www.jiep.or.jp/icep/index.html