Research & Development
Wave Solder Assembly
Solder Preform and Ribbon
Product Data Sheet Request
Quality Management System
Certificates of Registration
Agents & distributors wanted! Please send your message to Global Operation Center.
SPECIAL CLARIFICATION:All the Tin Ingots are purchased are from smelters qualified and listed in CFSI.
SHENMAO America, Inc. Exhibits at Booth # 14 at the MEPTEC Semiconductor Packaging Roadmap Symposium at the Holiday Inn Silicon Valley, San Jose, CA, U.S.A. on November 14, 2016
SHENMAO Technology presents Talk at IMPACT 2016.
SHENMAO America, Inc. Exhibits at IWLPC 2016 Booth # 12 at Double Tree by Hilton in San Jose, CA, U.S.A.
SHENMAO America, Inc. Exhibits at SMTA International 2016 Booth # 800 at the Donald E. Stephens convention Center, Rosemont, Il, U.S.A.
SHENMAO Technology, Inc. Exhibits at Semicon Taiwan 2016 Booth # J2922, Taipei Nangang Exhibition Center, Taipei, Taiwan.
SHENAMO Technology Exhibits at SEMICON West during 7/12~7/14, 2016 in San Francisco.
SHENMAO Technology Exhibits at “ECTC 2016” in Las Vegas, NV, USA—Booth No. 505
SHENMAO Technology co-authored with National Central University, Taiwan the Paper: “Development of New Low Melting Solder Alloys”, presenting at ECTC 2016 in Las Vegas, NV, USA.
SHENMAO Technology co-authored with National Central University, Taiwan a Paper, presenting at ICEP 2016 in Sapporo, Japan.
Bumping Solder Paste
Lead Free Solder Paste
Address : NO.12-1 Gongye 2nd.Rd., GuanYin Area, TaoYuan City 328. Taiwan
Telephone : +886-3-416-0177 Fax : +886-3-416-0133
E-Mail : email@example.com
& associated with