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SHENMAO Technology presents Talk at IMPACT 2017.
2017/10/27
Topic 1: A Novel Temporary Adhesive for Solder Ball Attachment in Fluxless System
Speaker: Hsiang-Chuan Chen
Authors: Ruei-Ying Sheng, Chen-Yi Chen, Hsiang-Chuan Chen, Chang-Meng Wang
Time: Session 4, 14:10-14:30, October 25.
Topic 2: A New Coating Technology on Solder Powder to Improve Solderability
Speaker: Chia-Hao Chang
Authors: Chen-Yi Chen, Ruei-Ying Sheng, Chia-Hao Chang, Hsiang-Chuan Chen, Chang-Meng Wang
Time: Session 26, 13:10-13:30, October 27.
Please refer to the websites for further information.
IMPACT 2017 http://www.impact.org.tw/
Technical Program http://www.impact.org.tw/index/agenda
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