Adhesive
Description
NO. |
Items |
Specification |
1 |
Chemical Type |
Epoxy |
2 |
Components |
One component |
3 |
Cure Type |
Heat cure |
4 |
Application |
Surface mount adhesive |
5 |
Suitable Process |
SM-150G : Glue dot process |
6 |
Viscosity |
SM-150G:55,000 ± 10000 cps |
7 |
Thixotropy index |
SM-150G:6.5 ± 1.0 |
Recommended Curing Condition | |||
Curing Temperature | 150℃ | 125℃ | 100℃ |
Curing Time | 1.5~2.0 min | 2.0~3.0 min | 9.0~10 min |
Push-off Strength | Shear Strength (N/mm2) | Shear forces (Kgf) | |
Chip Size | (Chip:1206R) | ≧15.0 | ≧7.0 |
(Chip:0805R) | ≧10.0 | ≧2.5 | |
(Chip:0603R) | ≧10.0 | ≧1.5 |