Semiconductor Packaging
BGA Sphere
  • Product Name : BGA Sphere

Description
BGA Solder Sphere is made from pure metals, to produce exact alloy compositions. We developed and produced under a strict research and quality control policy.

Our Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip applications are made by the UMT ( Ultra Micron Technology) to ensure spheres with accurate diameters, bright, shiny surface finishes; and high sphericity. We have own developed technology which reduces raw material cost, accordingly competitive price make users benefited. With our newest in-house production machine, we can comply with customer’s request of various sizes. BGA Sphere is available for customers' specifications.


Bumpping錫膏

 
Features
Diameter Tolerance
0.76mm~0.50mm ±20um
0.45mm~0.10mm ±10um
* Please contact us for other diameter and any requirement.