News
2017/3/27
SHENMAO Technology presents Talk at ECWC14 2017.



Topic: Study on A Formulated No Clean Flux for Fine-Pitch Flip Chip Package of Copper Pillar/ Microbump Interconnect
Speaker: Ya-Ching Chuang
Authors: Hsiang-Chuan Chen, Ya-Ching Chuang, Chia-Hao Chang, Watson Tseng
Time: 4/27, Session 16 Packaging Technology, 14:00-14:30.
Location: Room 305, KINTEX, S. KOREA.


Please refer to the websites for further information

ECWC14http://www.kpca.or.kr/kr/eng/ecwc/ecwc.php