SHENMAO Technology presents Talk at IMPACT 2016.
Topic: Study on A Formulated No Clean Flux for Fine-Pitch Flip Chip Package of Copper Pillar/ Microbump Interconnect
Speaker: Ya-Ching Chuang
Authors: Hsiang-Chuan Chen, Ya-Ching Chuang, Chia-Hao Chang, Watson Tseng
Time: Session 24, 10:30-12:30 PM, October 28.
Please refer to the websites for further information.
IMPACT 2016 www.impact.org.tw
Technical Program http://www.impact.org.tw/index/agenda