News
2016/5/24
SHENMAO Technology co-authored with National Central University, Taiwan the Paper: “Development of New Low Melting Solder Alloys”, presenting at ECTC 2016 in Las Vegas, NV, USA.


Topic: Development of New Low Melting Solder Alloys

Authors:
Chih-Hao Chen, Albert T. Wu – National Central University
Hsiang-Chuan Chen, Boon-Ho Lee, Chang-Meng Wang – Shenmao Technology, Inc.
Session 41: Student Interactive Presentations
08:30 AM – 10:30 AM, Friday, June 03, 2016


Please refer to the website for further information.

ECTC 2016 Technical Program https://www.ectc.net/program/index.cfm