Bumping Solder Paste
Bumping Solder Paste aims to decrease current issue of too much voids in the IC Packaging Manufactures.
Our applications engineers of SMMI focus on developing the lower Void, <100000ppm, of formula. It’s approved by our customers that can decrease void happened and optimizes the performance of manufacturing process.
Our Bumping Solder Paste was well-developed to have 6 month shelf life and can be storage just less than 10 degree C.