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国立中央大学化学材料研究室との共同研究論文をICEP 2016 に発表する予定。
2016/4/19
2016 International Conference on Electronics Packaging, April 20-22, 2016, Sapporo Education and Culture Hall.
Program: WB1 DMR-Mechanical
Topic: Non-destructive Testing Method for Chip Warpage - Applications of Synchrotron Radiation X-ray
詳細はICEP 2016のウェブページをご参考ください。
ICEP 2016 http://www.jiep.or.jp/icep/index.html
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