SHENMAO Technology Inc. Exhibits at SEMICON Southeast Asia 2018

SHENMAO Technology to Exhibit New Solder Alloy with High Thermal & Impact Reliability.

SAN JOSE, CA ― April 2018 ― SHENMAO America, Inc. today announced plans to exhibit in Booth 433 at SEMICON Southeast Asia, scheduled to take place May 22-24, 2018 at the new Malaysia International Trade & Exhibition Centre (MITEC) in Kuala Lumpur.
SEMICON SE Asia is the region's premier gathering of the industry for connecting people, products, technologies and solutions across the global electronics manufacturing supply chain. SHENMAO plans to introduce its new PF906-S and PF912-S solder alloys.

SHENMAO’s high thermal / drop reliability series solder alloys can be used in a wide range of solder applications. The alloys have a similar operating temperature window to Sn-Ag-Cu alloys, so that they can easily be adopted into existing packaging processes.

The PF906-S Sn/Ag4.0/Cu0.5/Bi3.0/Ni0.05 alloy has excellent thermal reliability and is designed for use in automotive electronic applications.

The PF912-S Sn/Ag2.0/Cu0.5/Bi3.0/Ni0.05 alloy has excellent thermal and impact reliability compared to conventional solder alloys such as SAC305 and SAC405.

Visit us at Booth #433 to speak with our technical expert.

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